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8-inch EFEM (SMIF)

High-precision SMIF interface optimized for 200mm fab lines.

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12-inch EFEM (FOUP)

Ultra-precision FOUP handling system for 300mm manufacturing.

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200mm SMIF Indexer

Ensures high-precision wafer transfer and indexing stability.

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300mm FOUP Module

The industry-standard loading system for advanced 300mm processes.

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Wafer Aligner (200/300mm)

High-resolution alignment for precise Notch and Flat orientation.

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Flip Unit (300mm)

Reliable wafer inversion module for double-sided processing.

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Make-to-Order

Customized designs tailored to
specific customer requirements.

Contamination Control

Strict control environments supporting
ISO Class 1 standards.

Modular Integration

Flexible modular architecture for
diverse equipment interfaces.

Global Leader in EFEM & Wafer Handling

BITEC delivers industry-leading Equipment Front End Modules (EFEM), engineered for superior throughput and maximum reliability. Our advanced atmospheric transfer technologies are trusted by global semiconductor manufacturers for their precision, safety, and scalable performance across both 200mm and 300mm platforms.

Systems & Platforms

  • 8-inch (200mm) SMIF Solutions
  • 12-inch (300mm) FOUP Solutions
  • Advanced Atmospheric Transfer Robots
  • Custom Load Port Interface Units

Key Technologies

  • High-Speed Auto Wafer Centering (AWC)
  • ISO Class 1 Fan Filter Unit (FFU) Systems
  • Universal Modular Hardware Architecture
  • Smart Process Tool Communication (SECS/GEM)
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